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Flip Chip Assembly Services

Microtek’s flip chip bonding assembly process provides customers with flexibility and greater latitude in product design. We work closely with you to develop the best solutions for your designs. We can develop custom solutions to meet your specific needs outside our standard offerings.

Flip chip bonding offers optimized electrical performance in addition to optimized miniaturization. The opportunity to control signal integrity from the die through the substrate to other die on the substrate or even packaged die on the substrate may provide the most significant benefit of flip chip assemblies. In addition, the flip chip process can eliminate the need for wire bonding, therefore, much smaller form factors are possible.

The variety of substrates available for flip chip applications allows a wide selection of electrical, thermal, CTE and mechanical properties tailored to specific application requirements. Ceramics and glass ceramics offer stable dielectric constant, low dielectric loss tangent and good thermal dissipation. Organic substrates can provide low dielectric constant and light weight as well as, in many cases, low cost.

The flip chip assembly process flow consists of four essential steps; die bumping, die attach, interconnect, and underfill. Bumping is generally provided by either the die supplier or Microtek.  Die attach and interconnect provides the mechanical and electrical connection of the die to the substrate and wiring pattern on the substrate simultaneously.  Underfill enhances thermal and mechanical vibration fatigue reliability as well as mechanical shock resistance of the flip chip joints.  For solder, the surface tension of molten solder wetting the pad on the substrate provides self alignment between the bumps on the die and the land pads on the substrate.  In most applications, flip chip bonding with solder requires flux application to pads on the substrate in order to ensure proper reflow for strong bonds as well as high production yields.

Microtek can place bumped devices within ±0.5μm placement accuracy, providing support from R&D, pilot and medium size production.  Die handling is standard from wafer (up to 8”), waffle-pack and gel-pack.

Similar to flip chip assembly, Microtek can also provide customer solutions for applications in:

  • Die Attach, Stacked Die, Die Sorting, Flip-Chip, MEMS, MOEMS, VCSEL, Photonics, Ultrasonic, Thermosonic, RFID, Sensor Assembly, Adhesive Bonding, Eutectic Bonding, Wire Bonding, Ribbon Bonding, Underfill.

More information about our services can be found here.

Get In Touch

Inquire today to see how we can provide unique, innovative solutions for your project.