Wire Bonding in Microelectronics is the most common interconnect technology. However, it can be challenging and can have a major effect on product quality.  The purpose of wire bonding is to create the electrical interconnection between the IC chip and the package. Decisions need to be made on the type of wire bonding technology, wire size, bonding method, pad plating, wire material, etc. in order to get the most reliable bonds. Factors for consideration include:

Type of Wire – The choice of wires can be dependent upon cost, pitch and current carrying capacity.

Bonding Method – Electrical characteristics and temperature limitations can help determine which wire bonding method to choose.

Bond Pads – Bond pads need to be designed for optimal wire bond connections. They should also be positioned within the design rules to create the shortest bond possible. The surface finish and size of the pad are also critical. For complex package designs, insulated wire bonding is an option. Please contact us for more details.

Testing – Microtek also has state-of-the-art equipment to perform ball pull and wire/ribbon bond shear tests for evaluation.

This Infographic provides more details of the factors that should be considered when designing your particular packaging. Please contact us for more information or to discuss your project requirements further. 

Wire Bonding in Microelectronics

At Microtek we help our clients take their projects from concept to reality. We work at the bare chip level while integrating microelectronics, bioscience and therapeutics to provide highly miniaturized applications. We are structured to provide a wide range of design, engineering and manufacturing solutions, offering a technical bridge from R&D through to full scale production. By working in close collaboration with our clients, novel and individual solutions are naturally attained.

Our packaging solutions include applications in Die Attach, Flip Chip, Wire Bonding in Microelectronics, Ribbon Bonding, Eutectic Bonding, MEMS, VCSEL, Photonics, RFID, Sensor Assembly, etc.